Setthibhak Suthithanakom

Setthibhak Suthithanakom

Researcher on 3D Bioprinting and 3D Printing of Soft Matter

Talks and Presentation

Invited Talk: 3D Printing Technology Overview and Soft Matter 3D Printing

November 08, 2023

Invited Talk, SCG Packaging PCL., Bangkok, Thailand

I’m delighted to have the opportunity to speak at SCGP, a multinational packaging solutions provider spun off from SCG, Southeast Asia’s largest cement company. My talk covered the overview of 3D printing technology, specifically the printing of paste-like materials, an area I specialize in. SCGP aims to explore innovative manufacturing processes to improve their workflow.

Guest Lecture: Introduction to Industrial Sensors

February 24, 2023

Guest Lecture, International School of Engineering (ISE), Chulalongkorn University, Bangkok, Thailand

I have been invited to provide a special lecture for undergraduate students at the International School of Engineering (ISE), Chulalongkorn University. In this session, I explain the main types of industrial sensors, their working principles, limitations, and implementations. I also highlighted my practical experiences with the sensor selection process for my research and engineering projects.

Guest Lecture: Machine Vision Workshop

February 07, 2023

Guest Lecture, International School of Engineering (ISE), Chulalongkorn University, Bangkok, Thailand

I have been invited to supervise a workshop session for undergraduate students in the Robotics and Artificial Intelligence Engineering Program at, the International School of Engineering (ISE), Chulalongkorn University.

Conference Presentation: Temperature Control for Hydrogel Bio-Printing

November 19, 2019

Conference Presentation, 9th IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM), 2019, Bangkok, Thailand

I presented my publication on the topic of “Temperature Control for Hydrogel Bio-Printing” at the 9th IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM)